2.5D and 3D ICs pose unique physical verification challenges due to their composition of multiple chipsets made from various materials integrated in three dimensions.
The Calibre Shift Left solutions assist 3D IC designers in optimizing designs and performing early physical verification, making it easier to identify and resolve assembly issues.
These solutions support a comprehensive 3D IC verification strategy that integrates trusted Calibre physical verification throughout the design and assembly stages.
Explore this white paper to learn how early package assembly verification can reduce 3D IC design complexity, covering:
- 2.5/3D IC designs
- 3D IC assembly flow
- 3D IC physical verification, and more!